According to reports, Samsung and SK Hynix are preparing to manufacture their sixth-generation high-bandwidth memory (HBM4) chips in large quantities.
According to reports, Samsung and SK Hynix are preparing to begin producing their sixth-generation high-bandwidth memory (HBM) chips in large quantities next year. The most recent memory chip, known as HBM4, is specifically designed for artificial intelligence (AI) tasks and offers notable improvements in performance and customization. The report states that SK Hynix would finish manufacturing in September 2026, while Samsung will start production in February 2026. Notably, Nvidia’s Vera Rubin AI accelerator system is expected to employ the majority of these processors.
According to reports, Samsung and SK Hynix want to produce HBM4 chips.
Both semiconductor behemoths will begin producing HBM4 AI memory chips in large quantities, according to South Korean publication SEDaily. Since Micron and other industry participants are not anticipated to start producing these chips until 2026, Samsung and SK Hynix may be able to set themselves apart from the competition. Samsung’s production cycle is expected to start earlier than SK’s in February.
Interestingly, the journal stated that it is doubtful that the new memory chips will be accessible to consumers. Rather, both businesses have separate agreements with Nvidia to provide the HBM4 for its Vera Rubin AI accelerator. According to a recent SamMobile report, Samsung is qualified to provide the necessary processors because it passed Nvidia’s quality testing.
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However, it is said that SK Hynix and TSMC are working together to implement a 12nm logic process for the base chip, which will serve as the HBM4’s brain. For the same, Samsung uses a 10nm logic technology. According to reports, the memory chip would improve power efficiency by about 40% and provide double the bandwidth. According to reports, HBM4 also offers improved chipset integration and cusomisability with both AI and non-AI goods.
Just looking at production volume, Samsung is reportedly producing more DRAM each month—6,50,000 units—than SK Hynix—5,50,000 units. According to reports, Samsung leads SK by around 10,000 units per month in the manufacture of HBM chips (1,70,000 vs. 1,60,000 units).
The consumer market is apparently not benefiting from the mass manufacturing since AI businesses have reportedly reserved both Samsung’s and SK Hynix’s HBM capabilities for the upcoming year. This implies that the RAM scarcity will probably last till 2026.
𝑭𝒐𝒓 𝑹𝒆𝒈𝒖𝒍𝒂𝒓 & 𝑭𝒂𝒔𝒕𝒆𝒔𝒕 𝑻𝒆𝒄𝒉 𝑵𝒆𝒘𝒔 𝒂𝒏𝒅 𝑫𝒆𝒂𝒍𝒔&𝑶𝒇𝒇𝒆𝒓𝒔, 𝑭𝒐𝒍𝒍𝒐𝒘 𝑻𝑬𝑪𝑯𝑵𝑶𝑿𝑴𝑨𝑹𝑻 𝒐𝒏 𝑻𝒘𝒊𝒕𝒕𝒆𝒓, 𝑭𝒂𝒄𝒆𝒃𝒐𝒐𝒌, 𝑰𝒏𝒔𝒕𝒂𝒈𝒓𝒂𝒎, 𝑮𝒐𝒐𝒈𝒍𝒆 𝑵𝒆𝒘𝒔 𝒂𝒏𝒅 𝑺𝒖𝒃𝒔𝒄𝒓𝒊𝒃𝒆 𝑯𝒆𝒓𝒆 𝑵𝒐𝒘. 𝑩𝒚 𝑺𝒖𝒃𝒔𝒄𝒓𝒊𝒃𝒊𝒏𝒈 𝒀𝒐𝒖 𝑾𝒊𝒍𝒍 𝑮𝒆𝒕 𝑶𝒖𝒓 𝑫𝒂𝒊𝒍𝒚 𝑫𝒊𝒈𝒆𝒔𝒕 𝑯𝒆𝒂𝒅𝒍𝒊𝒏𝒆𝒔 𝑬𝒗𝒆𝒓𝒚 𝑴𝒐𝒓𝒏𝒊𝒏𝒈 𝑫𝒊𝒓𝒆𝒄𝒕𝒍𝒚 𝑰𝒏 𝒀𝒐𝒖𝒓 𝑬𝒎𝒂𝒊𝒍 𝑰𝒏𝒃𝒐𝒙. 𝗝𝗼𝗶𝗻 𝗢𝘂𝗿 𝗪𝗵𝗮𝘁𝘀𝗔𝗽𝗽 𝗖𝗵𝗮𝗻𝗻𝗻𝗲𝗹𝘀 𝗙𝗼𝗿 𝗡𝗲𝘄𝘀 & 𝗥𝗲𝗮𝗹 𝗧𝗶𝗺𝗲 𝗗𝗲𝗮𝗹 𝗔𝗹𝗲𝗿𝘁𝘀.